On the morning of January 18, 2024, Guangdong Jinsheng Intelligent CNC Co., Ltd. (hereinafter referred to as "our company") and Dongguan Institute of Technology Science and Technology Innovation (hereinafter referred to as "Science and Technology Innovation Institute") held a signing ceremony for the "Chip Manufacturing Terminal Digital Intelligence Detection and Flexible Packaging Adaptation Process Equipment Engineering Technology Center". Our chairman Sun Ping, deputy general manager Wu Hongjun, deputy general manager Wang Hui and financial director Deng Congyu, together with the dean of the Science and Technology Innovation Institute Xia Nengli, Professor Zhou Zirong, teacher Wu Peng of the School of Mechanical Engineering and project-related personnel attended the signing ceremony.
General Manager Sun Ping and President Xia Nengli signed the Engineering Technology Center Agreement on behalf of both parties. The signing of the agreement marks that the two parties will cooperate more closely and make progress together.
The on-site meeting was chaired by Tang Guo from the Cooperation and Development Department of the Institute of Science and Technology Innovation. She gave an annual report on the achievements of the cooperation since the two parties signed the "Cooperation Agreement on the Development and Promotion of Enterprise Technological Innovation Capabilities and the Strengthening of Scientific and Technological Innovation Attributes" in April 2023. She said that since the signing of the agreement, the two sides have actively carried out project exchanges and docking work, and have excellently completed the requirements of the 2023 work plan, and have achieved remarkable results in work goals and work quality; this cooperation also marks that the two sides have taken another solid step, which will surely inject new vitality into future scientific and technological development and industrial innovation. In 2024, the two sides will also achieve better and more significant results with closer and deeper cooperation.
General Manager Sun Ping said in his speech that the cooperation with the institute will provide our company with more high-quality scientific research results and accelerate the industrialization and commercialization of technological achievements. At the same time, this will also attract more outstanding talents for our company and enhance the company's core competitiveness. The signing of the two parties will provide a more solid foundation for cooperation in corporate development planning, technology research and development, and international intellectual property layout. Our company will devote itself to the strategic cooperation and hope to help enterprises explore the capital market through the cooperation between the two parties, embark on a new journey, and reach new heights.
President Xia Nengli gave a detailed interpretation of our company's scientific and technological innovation attribute planning report. He pointed out that enterprises should steadily advance various tasks around the plan; emphasized that both parties should seize opportunities, especially in the direction of developing the trillion-yuan cluster "high-end equipment" in Dongguan City, and Jinsheng Company should use the huge advancement of the core technology of the back-end packaging process of high-end equipment to further expand the layout space of core patents.
Professor Zhou Zirong emphasized the importance of standardization in his speech. He proposed that enterprises should clarify the direction of standardization construction and actively promote the joint development of downstream industries; he emphasized the importance of breaking through industry barriers and promoting the standardization of semiconductor terminals to contribute to the healthy development of the industry.
After signing the agreement, the two sides had a warm and friendly exchange. Both sides expressed their expectations and confidence in this cooperation. The two sides will strengthen communication and docking, formulate more reasonable planning and strategic deployment, especially in the construction and development of the engineering technology center, the international market layout of the enterprise, the construction of enterprise standards and the 2024 annual work plan, strengthen cooperation and achieve win-win results. It is believed that with the joint efforts of both parties, the engineering technology center will become an important force in promoting scientific and technological innovation and industrial upgrading in [industry or field], and make positive contributions to the sustainable development of the industry.